A.C.T., Inc. has over 20 years of experience in design, substrate manufacturing and final assembly of complex hybrids for the industrial controls, medical, and aerospace industries.

Communications
Rebuilding Documentation
High Volume Communications Hybrid

When a contract manufacture recently went out of business and closed its doors, numerous customers’ product line came to a grinding halt.  Not only was partially finished product locked up but so were drawings, custom tooling, intellectual property, and manufacturing know how.  ACT rebuilt the customers’ product and tooling drawings in record time.  We also worked closely with the customer to re-engineer some products for better manufacturability and usage of materials.

Aerospace

Redesign for Manufacturing – Accelerometers and Sensors Moving High Reliability Product Concept/Prototype into Pre- production and Volume Production

ACT has been chosen by a major R&D Firm to provide high reliability thick film hybrids that will see the rigors of aerospace flight via a mission in the space shuttle. This critical program takes advantage of our re-design for manufacturing expertise to ensure that an elegant concept or prototype design may be properly built with the materials specified.

ACT is also providing  non-destructive Wire Bond Pull Testing to ensure that the product performs properly and safely in its environment.



THICK FILM DESIGN, MANUFACTURING & ASSEMBLY CAPABILITIES

Substrate Production

  • 96% Alumina, 99% Alumina, BeO, ALN, and others
  • Substrate Print & Fire 2,400 sq. ft. 10K Class Clean Room
  • Three RTC Thick Film Firing Furnaces
  • Five DEK Thick Film Printers
  • Auto Load and Unload
  • Multiple Up Capabilities
  • In-House Screen Production

Integrated Passive Components

  • Resistors
  • Capacitors
  • Inductors

Laser Triming

  • Active
  • Passive
  • Ratio Matching
  • Thermistor Trimming

Assembly

  • Die Attach
  • Wire Bonding
  • Surface Mount Components - Epoxy & Solder Attach
  • Wire Attach
  • Testing
  • Special - underfill, glop top, etc.

Design

  • Complete Thick Film Design Capabilities
  • Conductor Lines to 8 mils
  • Resistor Design
  • Chip and Wire
  • Ball Grid Arrays
  • Custom Electronic Packages
  • Extensive Experience in Complex Hybrid & Power Hybrid Design
  • Fast Design & Prototype Turnarounds


Contract Electronic Assembly :: Box Build Manufacturing :: Thickfilm Hybrid Design & Assembly

Design Process & Features :: Facilities & Equipment :: Product Samples

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