Our Equipment

PCB Assembly

• 14000 SF Assembly Room, Conductive Flooring, Humidity Controlled
• DEK Fine Pitch Solder Printers with Vision
• 7 Pick and Place Lines
• 3 BTU Convection Solder Reflow Oven
• 1 MCT Browne Hybrid Reflow System
• 2 Branson Automatic Wash System
• 3 Contact 400D Cut and Clinch Machine
• 1 Asymtek Dispensing Machine for Circuit Encapsulation
• 3 Wayne Kerr ATE Combination Test Systems
• 1 Cerprobe Probing Station for Hybrid ATE
• 6 PC Based Functional Test Systems
• 5 Blue M Ovens for Epoxy/Encapsulation Cure
• 1 Bittle High Pot Tester
• 2 Electrovert SMT Wave Solder Machines
• 1 Data IO Promaster 2500 Automatic PLD Programmer
• 1 Data IO Engineering Programming Station
• 1 Hybrid Assembly Burn-In System
• 1 Auto Splice Socket Inserter
• 1 Glenbrook Technologies RTX-113 X-Ray Inspection System
• 1 SMT Tools BGA-100 Inspection Tool
• 1 Thermal Cycle - Thermal Shock
• 1 YTV-1000 AOI Automated Optical Inspection System
• 1 Trek Aqueous Cleanerhttp://www.trekindustries.com/index.html
• 1 CyberOptics Solder Paste Inspection system.

Thick Film Hybrid Manufacturing

• 2400 SF Class 10K Clean Room, Static Dissipative Flooring
• 1 Ceramic Substrate Wash System
• 5 DEK Manual Thick Film Screen Printers
• 1 DEK Automatic Thick Film Printer with Load/Unloader
• 3 RTC Thick Film Firing Furnaces
• 2 CLS Passive Trim Laser with Step and Repeat Handler
• 2 CLS Active Trim Lasers
• 1 Veeco Mass Spectrometer Leak Tester
• 3 K&S 1419 Automatic Ball Bonders
• 1 K&S 1470 Automatic Aluminum Bonder
• 2 Fine Gold Wire Bonders
• 1 Fine Aluminum Wire Bonder
• 1 Heavy Aluminum Wire Bonder
• 1 Trebor Die Bonder
• 1 Asymtek Dispensing Machine for Die Encapsulation
• 1 Laurier Hybrid Repair Station
• 1 Tencor Sigma Scan Thickness Measurement System

Thick Film Engineering

• 2 Thick Film Design CAD Stations
• 1 FST Forcing Air Jet System
• 3 Thermotron Environmental Chambers
• 1 Teledyne TAC Hybrid Probe Card Station
• 1 Darkroom Equipped for Screen Processing