EQUIPMENT LIST

PCB ASSEMBLY

14000 SF Assembly Room, Conductive Flooring, Humidity Controlled
DEK Fine Pitch Solder Printers with Vision
7  Pick and Place Lines
3  BTU Convection Solder Reflow Oven
1  MCT Browne Hybrid Reflow System
2  Branson Automatic Wash System
3  Contact 400D Cut and Clinch Machine
1  Asymtek Dispensing Machine for Circuit Encapsulation
3  Wayne Kerr ATE Combination Test Systems
1  Cerprobe Probing Station for Hybrid ATE
6  PC Based Functional Test Systems
5  Blue M Ovens for Epoxy/Encapsulation Cure
1  Bittle High Pot Tester
2  Electrovert SMT Wave Solder Machines
1  Data IO Promaster 2500 Automatic PLD Programmer
1  Data IO Engineering Programming Station
1  Hybrid Assembly Burn-In System
1  Auto Splice Socket Inserter
1  Glenbrook Technologies RTX-113 X-Ray Inspection System 
1  SMT Tools BGA-100 Inspection Tool
1  Thermal Cycle - Thermal Shock
1  YTV-1000 AOI Automated Optical Inspection System
1 Trek Aqueous Cleanerhttp://www.trekindustries.com/index.html
1 CyberOptics Solder Paste Inspection system.

THICK FILM MANUFACTURING

2400 SF Class 10K Clean Room, Static Dissipative Flooring
1  Ceramic Substrate Wash System
5  DEK Manual Thick Film Screen Printers
1  DEK Automatic Thick Film Printer with Load/Unloader
3  RTC Thick Film Firing Furnaces
2  CLS Passive Trim Laser with Step and Repeat Handler
2  CLS Active Trim Lasers
1  Veeco Mass Spectrometer Leak Tester
3  K&S 1419 Automatic Ball Bonders
1  K&S 1470 Automatic Aluminum Bonder
2  Fine Gold Wire Bonders
1  Fine Aluminum Wire Bonder
1  Heavy Aluminum Wire Bonder
1  Trebor Die Bonder
1  Asymtek Dispensing Machine for Die Encapsulation
1  Laurier Hybrid Repair Station
1  Tencor Sigma Scan Thickness Measurement System

THICK FILM ENGINEERING

2  Thick Film Design CAD Stations
1  FST Forcing Air Jet System
3  Thermotron Environmental Chambers
1  Teledyne TAC Hybrid Probe Card Station
1  Darkroom Equipped for Screen Processing

OUR FACILITY

Advance Circuit Technology is located in a 35,000 sq. ft building that was purchased and renovated to provide a modern facility for electronic manufacturing. The decision was made to purchase a building rather than lease.  This was done because we have made a commitment to be  a stable long  term resource for our customers.

The main factory area is 14,000 sq. ft., featuring temperature and humidity control with a anti static floor to provide  the optimum environment for electronic assembly. There is also a new compressed air system to provide clean, dry air, a new nitrogen gas distribution system, and a deionized water system through out the area. Everything has been designed to provide the maximum flexibility for changing the factory as our needs and the needs of our customers change.