EQUIPMENT LIST

PCB ASSEMBLY

14000 SF Assembly Room, Conductive Flooring, Humidity Controlled
DEK Fine Pitch Solder Printers with Vision
7  Pick and Place Lines
3  BTU Convection Solder Reflow Oven
1  MCT Browne Hybrid Reflow System
2  Branson Automatic Wash System
3  Contact 400D Cut and Clinch Machine
1  Asymtek Dispensing Machine for Circuit Encapsulation
3  Wayne Kerr ATE Combination Test Systems
1  Cerprobe Probing Station for Hybrid ATE
6  PC Based Functional Test Systems
5  Blue M Ovens for Epoxy/Encapsulation Cure
1  Bittle High Pot Tester
2  Electrovert SMT Wave Solder Machines
1  Data IO Promaster 2500 Automatic PLD Programmer
1  Data IO Engineering Programming Station
1  Hybrid Assembly Burn-In System
1  Auto Splice Socket Inserter
1  Glenbrook Technologies RTX-113 X-Ray Inspection System 
1  SMT Tools BGA-100 Inspection Tool
1  Thermal Cycle - Thermal Shock
1  YTV-1000 AOI Automated Optical Inspection System
1 Trek Aqueous Cleanerhttp://www.trekindustries.com/index.html
1 CyberOptics Solder Paste Inspection system.

THICK FILM MANUFACTURING

2400 SF Class 10K Clean Room, Static Dissipative Flooring
1  Ceramic Substrate Wash System
5  DEK Manual Thick Film Screen Printers
1  DEK Automatic Thick Film Printer with Load/Unloader
3  RTC Thick Film Firing Furnaces
2  CLS Passive Trim Laser with Step and Repeat Handler
2  CLS Active Trim Lasers
1  Veeco Mass Spectrometer Leak Tester
3  K&S 1419 Automatic Ball Bonders
1  K&S 1470 Automatic Aluminum Bonder
2  Fine Gold Wire Bonders
1  Fine Aluminum Wire Bonder
1  Heavy Aluminum Wire Bonder
1  Trebor Die Bonder
1  Asymtek Dispensing Machine for Die Encapsulation
1  Laurier Hybrid Repair Station
1  Tencor Sigma Scan Thickness Measurement System

THICK FILM ENGINEERING

2  Thick Film Design CAD Stations
1  FST Forcing Air Jet System
3  Thermotron Environmental Chambers
1  Teledyne TAC Hybrid Probe Card Station
1  Darkroom Equipped for Screen Processing

OUR FACILITY

Advance Circuit Technology is located in a 35,000 sq. ft building that was purchased and renovated to provide a modern facility for electronic manufacturing. The decision was made to purchase a building rather than lease.  This was done because we have made a commitment to be  a stable long  term resource for our customers.

The main factory area is 14,000 sq. ft., featuring temperature and humidity control with a anti static floor to provide  the optimum environment for electronic assembly. There is also a new compressed air system to provide clean, dry air, a new nitrogen gas distribution system, and a deionized water system through out the area. Everything has been designed to provide the maximum flexibility for changing the factory as our needs and the needs of our customers change.

Contract Electronic Assembly :: Box Build Manufacturing :: Thickfilm Hybrid Design & Assembly

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