CONTRACT ELECTRONIC ASSEMBLY SERVICES
Electronic Assembly & Test
Clean, Modern Electronic Assembly Facility
Static Dissipative Flooring for Static Protection
Fine Pitch Solder Printing & Component Placement
Surface Mount Component Placement
Through-Hole Capabilities
Automatic PLD Programming
Three Pick & Place Systems
Custom ATE Functional Test Programs & Fixturing
Reflow and Wave Soldering
Encapsulation Capabilities
Turnkey and Kitted jobs
Prototype to Medium Volume, Fast Turn Experts
Thru-Hole
Though thru hole technology is mature, there are still applications that require this hand and semi automatic insertion. Our experienced employees are equipped to support all customer needs.
Surface Mount
3 DEK Solder Paste Printer (Thick Film)
3 DEK 248/249 Fine Pitch Solder Printer with Vision
7 Pick and Place Machines with Full Vision
1 BTU VIP70 Convection Solder Reflow Oven
2 RTC Solder Reflow Oven (Nitrogen)
1 MCT Brown Hybrid Reflow System
3 Branson Automatic Wash Systems
3 Contact 400D Cut and Clinch Machines
1 Asymtek Dispensing Machine for Circuit Encapsulation
3 Wayne Kerr ATE Combination Test Systems
1 Cerprobe Probing Station for Hybrid ATE
6 PC Based Functional Test Systems
5 Blue M Ovens for Epoxy/Encapsulation Cure
1 Autosplice Socket Inserter
1 Electrovert Econopak II SMT Wave Solder Machine
1 Electrovert Minipak 300 Wave Solder Machine
1 Data I/O Promaster 2500 Automatic PLD programmer
1 Hybrid Assembly Burn-In System
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