DESIGN PROCESS

Set grid

Set scale

Select substrate size

Select circuit size

Get parts from libraries

Place all fixed pads or components

Use spreadsheet to design resistors

Create resistors from data

Create layers

Partition circuit for short traces and critical areas

Route traces and components

Layout probe cards

Add layers as needed

Transfer solder pads to overglaze and solder layers

Change sizes as needed (enlarge or reduce)

Transfer test pads to overglaze layer

Change size as needed (enlarge or reduce)

Check layers (color coded)

Check design to schematic

Create data files for holes, components, and resistors

Create artwork files

Check artwork files

Order Artwork

DESIGN SYSTEM FEATURES

What you see is what you get graphic display:
Shape based design
Trace routing
Component routing

Unlimited layers.

Easy to use component libraries.

DRC semi-auto using grid and color coding.

Long file names allowing description and part number.
Example: "ACT 586232-2 C 960918A"

Direct creation of data file for:
Component location data
Hole location data

Resistor design:
Dimensions are calculated in a spreadsheet
Flexible
Resistor test information from spreadsheet for as fired and final trim
Probe card design (which is part of the board layout)

Artwork Generation:
Postscript
Easy to generate
Direct from CAD data (no 3rd party software needed)
Inexpensive
Easy to check
Data files can be sent directly to any postscript device
(laser printer 600 dpi, Plotter 600 dpi, Photo plotter 4,000 dpi, etc.)

All aspects of design are integrated into 1 database, maintained under 1 file name, in 1 location & includes:
All layers
Single-up layout
Panelized layout
Substrate drawings
Photo tool files
Documentation files

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