Capabilities

Design through Final Production

Circuit Board Assembly & Testing

• Assembly: Surface Mount as small as 0201 and Thru-hole
• Testing: Functional, Bed of Nails, Thermal Shock and Cycling, Altitude Chamber

Technologies

• Organic Substrates: FR4, Aluminum Clad, Polyimide
• Ceramic Substrates: Al₂O₃, AlN, BEO

Processes for Conductors and Resistor Networks

• Laser Trim Resistors and Capacitors
• Die Attach
• Wire-Bond (Thermosonic and Ultrasonic)
• Encapsulating
• Parylene Coating